Camera module back-focal length adjustment method and ultra compact components packaging

ABSTRACT

The present invention relates to methods of manufacturing ultra-compact camera modules, adjusting them, post production, to precise focal point settings, and sealing the precisely aligned assembly to maintain the focal point. Also, the invention specifically relates to ultra-compact camera module apparatuses.

RELATED APPLICATIONS

This patent application claims priority under 35 U.S.C. §119 (e) of theco-pending U.S. Provisional Patent Application Ser. No. 60/961,312,filed Jul. 19, 2007, and entitled, “CAMERA MODULE BACK-FOCAL LENGTHADJUSTMENT METHOD AND ULTRA COMPACT COMPONENTS PACKAGING”. TheProvisional Patent Application Ser. No. 60/961,312, filed Jul. 19, 2007,and entitled, “CAMERA MODULE BACK-FOCAL LENGTH ADJUSTMENT METHOD ANDULTRA COMPACT COMPONENTS PACKAGING” is also hereby incorporated byreference in its entirety.

FIELD OF THE INVENTION

The present invention relates generally to the field of miniaturephotography modules. More specifically, the present invention relates tomethods of manufacturing ultra-compact camera modules, adjusting thempost production to precise focal point settings and sealing theprecisely aligned module to maintain the focal point. Also, theinvention specifically relates to ultra-compact camera moduleapparatuses.

BACKGROUND OF THE INVENTION

Designers of camera modules are perpetually faced with the challenge ofpackaging components inside a small envelope. Recently, the cameramanufacturing industry has seen a rapid decrease in the size ofcomponent envelopes. One reason for the rapid pace of ever-shrinkingcamera technology has been the integration of camera technology andminiature consumer electronic products, such as cellular telephones witha digital camera incorporated therein. Furthermore, there is anever-increasing trend to install miniature cameras in a wide variety ofother consumer products not ordinarily associated with typical cameraapplications.

Some of the parts used in a miniature camera include: a lens packagecontaining the lenses needed for the given application, an imagingdevice and a barrel housing to house the lens package and to allowoptical communication between the lens package to the imaging device.Further, it is desirable for the manufacturers of the miniature camerasto be able to mass produce camera modules. Often times, however, massproduction results in small differences in size of the module componentsand size differences from the manufacturing process. Therefore, postassembly focusing is needed to adjust the focal point (back focallength) of mass-produced lens packages to account for tiny differencesin the manufactured part and based on the differences needed in givenspecific applications. Also, it is desirable for the camera modulemanufacturers to be able to achieve these goals while maintaininghigh-quality standards, reliability and commercial feasibility.

Various solutions have been proposed to solve the problems associatedwith manufacturing ultra-compact camera modules with the ability tofocus assembly parts after they are assembled. One approach used todecrease the size of the module utilizes traditional wire bondingtechnology and integrates the imaging device onto a substrate whichcontains other necessary electronic components. Examples of thissubstrate may include ceramic, BT, FR4, etc. Those having ordinary skillin the art will recognize that any suitable substrate may be used.However, this approach wastes space. For example, an imaging devicecomprised of an array of charge-coupled devices (CCD) or an array ofCMOS sensors include some amount of space around the array for contactattachment pads used in the wire bonding method. Such placement forcesthe designer of the integrated chip and camera module to position thecomponents around the extra space, thus taking up more space.

Other approaches used to provide an ultra-compact camera module havingthe ability to focus the manufactured parts utilizes a lens package witha barrel housing and a rotatable lens barrel. One approach utilizes abarrel housing having an internal thread surface and lens barrel havingan external thread. According to this approach, the lens barrel isscrewed into the barrel housing until the focal point of the lenspackage falls on the appropriate point. In another approach, the barrelhousing has a ramp design and the lens barrel is rotated within thebarrel housing which causes the lens barrel to move up the ramp. Thismovement adjusts the lens barrel in order to obtain the appropriatefocal point.

However, these solutions cannot be applied to applications havingangularly position-sensitive components. For instance, applicationsutilizing an array of charge-coupled devices (CCD) or CMOS sensors asthe imaging device often times require that the imaging device and theactuator assembly be precisely aligned prior to adjusting focal point toaccount for the differences noted above. In this case, the precisealignment will be compromised by rotating the lens barrel to adjust thefocal point.

Some camera module manufacturers have utilized resilient structures toadjust the focal point of a lens package. According to one method, alens barrel is placed within a barrel housing which includes a resilientstructure such as cushion or springs. The lens barrel is moved up ordown to adjust the focal point of the system. As such the resilientstructures either compress or expand based on the position of the lensbarrel. This method presents a number of problems. First, once the focalpoint of the system is found, the pressure applied to the resilientstructure must be maintained at a constant while the lens barrel islocked in place. Next, the pressure applied to the structures is oftenachieved by screwing the lens barrel into the housing barrel. Again,this causes unwanted rotation of the lenses in relation to the imagingdevice. Other methods of using resilient structure lack reliability dueto creep damage and fatigue effects that occur to the resilientmaterial, which, over time decreases the reliability of the camera.

What is needed is a method to effectively adjust the focal point ofcamera modules while maintaining an ultra-compact envelope, precisealignment of the lens package in relation to the imaging device andreliability of the integrity of the adjusted parts.

SUMMARY OF THE INVENTION

The present invention relates to methods of manufacturing anultra-compact camera modules, adjusting them post production to precisefocal point settings and sealing the precisely aligned assembly tomaintain the focal point. Also, the invention specifically relates toultra-compact camera module apparatuses.

In some embodiments of the present invention, the method ofmanufacturing an ultra-compact camera module includes manufacturingparts, aligning the parts, adjusting the focal point of a lens packageand sealing the part to achieve reliability.

In some embodiments of the present invention, a ramp bridge is used toadjust the focal point of the lens package without rotating an actuatorassembly in relation to a barrel housing. In other embodiments, afixture is used to secure an actuator assembly in order to adjust thefocal point.

In some embodiments of the present invention, a substrate and an imagingdevice are coupled to the ultra-compact camera module. In someembodiments of the present invention, a substrate cavity is formed inthe substrate and the imaging device is coupled to the substrate using aflip-chip packaging approach.

In some embodiments of the present invention, the approach of couplingan imaging device using flip-chip packaging to a substrate opens up roomon the top of the surface and the method of manufacturing and adjustingthe assembly pieces in an ultra-compact camera module producesynergistic results when both novel methods are practiced together.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A illustrates a basic isometric view of the ultra-compact cameramodule according to some embodiments of the present invention.

FIG. 1B illustrates the process steps involved in the method ofmanufacturing, adjusting and maintaining accurate focal point settingsin an ultra-compact camera module.

FIG. 1C illustrates the process steps involved in aligning thecomponents according to some embodiments of the present invention

FIG. 1D illustrates a cross-section view of one embodiment of theultra-compact camera module according to some embodiment of the presentinvention.

FIG. 2 illustrates an exploded isometric schematic view of anultra-compact camera module with a ramp bridge according to someembodiments of the present invention.

FIG. 3 illustrates an exploded isometric schematic view of anultra-compact camera module using a fixture according to someembodiments of the present invention.

FIG. 4A illustrates an isometric semi-exploded schematic view of abarrel housing, a substrate and an imaging device according to someembodiments of the present invention.

FIG. 4B illustrates a side cross-section schematic view of the of anultra-compact camera module utilizing flip-chip coupling according tosome embodiments of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention relates to methods and apparatuses which are ableto precisely manufacture, adjust and maintain accurate focal pointsettings in an ultra-compact camera module. Those of ordinary skill inthe art will realize that the following detailed description of thepresent invention is illustrative only and is not intended to limit theclaimed invention. Other embodiments of the present invention willreadily suggest themselves to such skilled persons having the benefit ofthis disclosure. It will be appreciated that in the development of anysuch actual implementation, numerous implementation-specific decisionsmust be made in order to achieve the developer's specific goals.Reference will now be made in detail to implementations of the presentinvention as illustrated in the accompanying drawings. The samereference indicators will be used throughout the drawings and thefollowing detailed description to refer to the same or like parts.

FIG. 1A illustrates an isometric schematic view of the basic componentsof the ultra-compact camera module according to some embodiments of thepresent invention. As shown, the ultra-compact camera module 11includes: an actuator assembly 10, a lens barrel 30, a ramp bridge 60, abarrel housing 90, a substrate 91, a substrate cavity (not shown) formedin the bottom surface of the substrate 91 and an imaging device (notshown).

FIG. 1B illustrates the process steps involved in the method ofproviding an ultra-compact camera module. Although the description ofthe process includes reference to the component parts mentioned in thediscussion of FIG. 1A, it will be clear to those having ordinary skillin the art, that the general process is able to be carried out usingsubstitute, or in some cases, different parts, as described elsewhere inthe disclosure or as known by those having ordinary skill in therelevant art.

The process can be described as follows: the step 100 involves providingindividual components comprising the camera module 100; the step 200involves aligning the manufactured parts 200; the step 300 involvesvertically adjusting the position of the lens barrel 30 relative to thebarrel housing 90 without rotating the actuator assembly 10; and thestep 400 involves sealing the adjusted parts to maintain a proper focalpoint.

In some embodiments of the present invention, the step 300, whichinvolves vertically adjusting the position of the lens barrel 30relative to the barrel housing 90 without rotating the actuator assembly10 is accomplished by rotating the ramp bridge 60 on ramps (not shown)within the barrel housing 90 while the lens barrel 30 is fixed to thebarrel housing 90 by locking keys (explained below) such that the rampbridge 60 exerts a vertical force on the lens barrel 30 while thelocking keys resists the rotational force.

In some embodiments of the present invention, the step 100 includesmanufacturing assembly pieces as well as providing individual componentscomprising the ultra-compact camera module. In other embodiments, thestep 100 of providing individual components comprising the ultra-compactcamera module further includes manufacturing a substrate assembly forholding a sensor comprising an imaging device (explained below). In someembodiments of the present invention, the method comprises manufacturingan imaging device suitable for miniature camera applications. In yetother embodiments of the present invention, the step 100 of providingindividual components comprising the ultra-compact camera module furtherincludes providing a fixture (not shown), instead of the ramp bridge 60,wherein the fixture used to secure the actuator assembly 10 in placewhile the lens barrel rotates (explained below).

Once all the necessary parts are selected for a chosen camera modulemanufacture, the step of aligning the components 200 is performed. FIG.1C illustrates the process steps involved in aligning the components 200according to some embodiments of the present invention. The processincludes: the step 295 of attaching a sensor into the substrate cavity;the step 296 of coupling the substrate to the bottom of a barrelhousing; the step 297 of coupling an actuator assembly to a lens barrel;the step 298 of coupling a ramp bridge to the lens barrel; and the step299 of inserting and fixing the lens barrel into and within the barrelhousing. In the preferred embodiment, step 295, the step of coupling asensor into the substrate cavity, is performed using the novel flip-chipapproach of the present invention (explained below).

Referring again to FIG. 1B, once the parts are aligned, the step 300 ofvertically adjusting the position of the lens barrel 30 relative to thebarrel housing 90 without rotating the actuator assembly 10, isperformed. The lens barrel 30 is adjusted relative to the imaging devicesuch that the focal point of the lens package (not shown) fallsincident, at least substantially, on the imaging device.

In some embodiments which utilize a ramp bridge 60, the ramp bridge 60is rotated using a specially designed focus testing fixture tool (notshown). Using such a tool allows camera modules to be adjusted quickly,and in a factory line setting. In alternate embodiments, the ramp bridge60 is rotated by any manual means, including hand rotation.

In alternative embodiments of the present invention, the ramp bridge 60is omitted from the module assembly, the lens barrel 30 is adjusted byrotating the lens barrel 30 itself while the actuator assembly 10 isheld fixed by a fixture (explained below). In some embodiments of thepresent invention, the lens barrel 30 is rotated with a speciallydesigned focus testing fixture tool. In other embodiments, the lensbarrel 30 is rotated by any means, including hand rotation.

Once the lens barrel 30 is adjusted to the proper focal point, the stepof sealing the adjusted parts to maintain a proper focal point 400 isperformed. FIG. 1D illustrates a side schematic view of the locations ofsealing according to some embodiments of the present invention. Shown isthe barrel housing 90, ramp bridge 60, lens barrel 30, substrate 91 andimaging device 92. In some embodiments of the present invention, anadhesive (not shown) is injected in locations where the parts interfaceprior to assembly and focusing. According to these embodiments, thecomponents are focused and maintained in a focused position as theadhesive cures. In some embodiments, a thermocompression process is usedto seal the parts. In some embodiments, a thermosonic process is used toseal the parts. In some embodiments, the adhesive is a thermal cureepoxy. In yet other embodiments, ultra-violet curing epoxy tags are usedto hold the components in place while the adhesive cures.

In the preferred embodiment of the present invention, a thermal cureepoxy is inserted on the surfaces where the parts interface.Specifically, the thermal cure epoxy is inserted at points 1, 2, 3 and4. Next, the lens barrel 30 is inserted into the barrel housing 90 andis focused. Once properly focused, a set of ultra-violet curing epoxytags 5, 6 are used at a number of points where the lens barrel 30 andbarrel housing 90 meet. Ultra-violet light is used to cure the epoxytags such that the tags hold the components in place during the thermalcuring process. Next, the focused and tagged components are subjected toheat in order to cure the thermal cure epoxy. By using the epoxy tags,heat from the process of curing the thermal cure epoxy does not causemovement between lens barrel 30 and the barrel housing 90 as mightnormally occur due to normal effects of heat on the materials used intypical camera module applications.

Also shown in FIG. 1D is a particle trap comprising the areas 7, 8 and9. The particle trap ensures that loose debris (not shown) present onthe assembly pieces or found between the assembly pieces become trappedin area 8 and do not pass through area 9 onto the recording surface 92.

FIG. 2 illustrates a detailed, exploded perspective schematic view of anultra-compact camera module 201 with a lens barrel 230, a ramp bridge260, a barrel housing 290 and substrate surface 291 according to someembodiments of the present invention. For ease of description, a numberof components are purposefully omitted such as lenses and electricalcouplings.

The substrate 291 comprises a substrate surface 293 and an aperture 292passing through the substrate surface 293. In some embodiments of thepresent invention, an imaging device (not shown) is located within theaperture 292. In some embodiments of the present invention, electroniccomponents 289 are disposed on the substrate surface 293 and are used tocontrol various functions associated with the ultra-compact cameramodule including, auto focusing functions, among others. Preferably, theimaging device (not shown) is physically and electronically coupled tothe substrate 291 with the flip-chip process according to the presentinvention (explained below).

The barrel housing 290 comprises a cylindrical surface 283, acylindrical volume 288, ramps 287, slots 286 and a housing base 285. Insome embodiments of the present invention, the housing base 285 includesa barrel housing cavity (not shown) on the under-side of the housingbase 285. According to these embodiments, the barrel housing cavity (notshown) accommodates the electronic components 289 when the barrelhousing 290 is coupled to the substrate 291.

The ramp bridge 260 comprises a ring 259, ramp feet 258, and barrelhousing alignment ribs 257. The ring 259 fits within the cylindricalvolume 288 of the barrel housing 290. When the ring 259 is positionedwithin the cylindrical volume 288, the ramp feet 258 rest on the ramps287 and the barrel housing alignment ribs 257 make contact with theinside surface of the cylindrical surface 283. As such, the verticalposition of the ramp bridge 260 is adjusted as the ramp bridge 260 isrotated up or down the ramps 287 within the barrel housing 290. In someembodiments of the present invention, a number of tabs 256 are disposedon the ring 259. The tabs 256 are provided to allow a tool (not shown)to grab onto the ring 259 and turn the ring 259 in a factory linesetting.

The lens barrel comprises a continuous cylindrical surface 229 withstand-off ridge 226 separating the top portion of the cylindricalsurface 229 and the bottom portion of the cylindrical surface 229. Thelens barrel 230 further comprises: actuator housing alignment ribs 228,a lens barrel cavity 227 and locking keys 225. The bottom portion of thecylindrical surface 229 is positioned within the ring 259 and thestand-off ridge 226 prevents the ring 259 from being pushed over the topportion of the cylindrical surface 229 when an upward force is exertedon the ring 259, thus moving the lens barrel 230 in the Z-directionwithout rotating the lens barrel 230 relative to the substrate surface291. When the lens barrel 230 is positioned within the ramp bridge 260,the ramp bridge 260 is able to freely rotate about the bottom portion ofthe cylindrical surface 229. When the lens barrel 230 and the rampbridge 260 are coupled as such, and the ramp bridge 260 is positionedwithin the barrel housing 290, the locking keys 225 fit within the slots286 while the ramp feet 258 rest on the ramps 287. The locking keys 225are designed to be longer than necessary to fit within the slots 286such that the lens barrel 230 is able to be moved in the Z-directionwhile the locking keys 225 maintain their position within the slots 286.When coupled in this fashion, the lens barrel 230 is forced verticallyupward, without being rotated itself, as the ramp bridge 260 rotates andmoves up ramps 287.

When the assembly pieces are assembled, an actuator assembly (not shown)is optionally coupled to the top of the lens barrel 230 and an imagingdevice (not shown) is positioned below the cylindrical volume 288. Insome embodiments of the present invention, the actuator assembly (notshown) and the lens barrel 230 are fitted with lenses (not shown)comprising a lens package (not shown), wherein the lens package has agiven focal point (not indicated). The vertical height of lens packageis able to be adjusted relative to the imaging device by rotating theramp bridge 260, causing the ramp feet 258 to move up and down the ramps287 forcing the ramp bridge 260 up in the Z-direction without rotatingthe lens barrel 230 or the actuator assembly (not shown). As such, thefocal point of the lens package is adjusted to be incident on theimaging device.

FIG. 3 illustrates an exploded isometric schematic view of anultra-compact camera module 301 according to some embodiments of thepresent invention. The module 301 illustrated in FIG. 3 provides analternate method of moving the lens barrel 330 vertically withoutrotating the lens barrel 330 in relation to an imaging device (notshown) by utilizing a fixture 361 rather than the ramp bridge 260 ofFIG. 2. The camera module 301 comprises a barrel housing 390, a lensbarrel 330, an actuator assembly 310 and a vertical adjustment fixture360. The barrel housing 390 comprises a cylindrical surface 389, abarrel cavity 388, ramps (not shown), and a housing base 385. The lensbarrel 330 comprises a cylindrical surface 329, actuator housingalignment ribs 328, a lens barrel cavity 327 and ramp feet 358. In someembodiments of the present invention, a stand-off lip 326 is provided toallow a tool (not shown) to grab onto the lens barrel 330 and rotate itin a factory line setting. The bottom of the cylindrical surface 329 ispositioned within the barrel housing 390. When fully inserted into thebarrel housing 390, the ramp feet 358 of the lens barrel 330 makecontact with the ramps (not shown) such that the ramp feet 358 travel upthe ramps (not shown) as the lens barrel is rotated within the barrelhousing 390. During rotation, the lens barrel alignment ribs 328 makecontact with the inside surface of cylindrical surface 389.

The actuator assembly 310 comprises a conduit 309 for allowing light topass through the actuator assembly 310 and other optical components (notshown) and lens (not shown) used for image capture. Furthermore, thebottom of the actuator assembly 310 comprises ridges 308 and 306 whichdefine a channel 307. The channel 307 is configured such that thecylindrical ridge 325 fits within the channel 307. As such, the actuatorassembly 310 is coupled to the top of the lens barrel 330.

The vertical adjustment fixture 360 comprises a shell 306 and a cavity305. The cavity 305 is comprised to fit over the actuator assembly 310such that the actuator assembly 310 cannot rotate within the cavity 305.In some embodiments of the present invention, the fixture 360 coupleswith an arm 361. According to these embodiments, the arm 361 is coupledto a machine (not shown) used to automatically adjust camera modulefocal points in a factory line setting.

It is another object of the present invention to decrease the size ofthe module by providing a new method of attaching an imaging device to asubstrate which contains other electronic components necessary forcamera applications including auto-focusing and shuttering, amongothers. The traditional method of coupling the imaging device to asubstrate comprises coupling an imaging device onto the top of asubstrate using traditional wire bonding techniques. However, thistechnique wastes space because the contact attachment pads for wirebonding force chip designers to spread out the components on thesubstrate surface to provide the necessary room to attach the inputs ofthe imaging device to contact attachment pads. Therefore, it is anobject of the present invention to utilize a flip-chip approach tocouple the imaging device to the substrate in order to decrease theamount of space on the top surface of the substrate dedicated to theimaging device.

FIG. 4A illustrates an isometric semi-exploded schematic view of animaging device 499, a substrate assembly 498 and a barrel housing 490.The substrate assembly 498 comprises a substrate surface 401 and isconfigured with a cavity (not shown) on the underside of the substratesurface 401. An aperture 497 passes through the substrate surface 401.Furthermore, a number of electrical components 489 are coupled to thesubstrate surface 401.

Furthermore, the substrate assembly 498 includes a number of contactattachment pads 402. The contact attachment pads 402 are located on theside surface of the substrate assembly 498 and also on the bottomsurface of the substrate assembly (not shown in FIG. 4A). The contactattachment pads 402 electronically couples the imaging device 499 andthe electronic components 489 with external electronic devices. In someembodiments of the present invention, the placement of the contactattachment pads 402 allows the miniature camera module to be used in anumber of generic camera applications. In other embodiments, the contactattachment pads 402 are specifically designed for a particularapplication.

The imaging device 499 comprises an imaging surface (indicated with adot pattern) and a connection surface 485. The imaging surface 480 isthe part of the imaging device 499 which actually receives and begins toprocesses image data. In some embodiments of the present invention, theimaging surface 480 comprises an array of CCDs. In other embodiments ofthe present invention, the imaging surface 480 comprises an array ofCMOS sensors. In general, the imaging surface 480 can comprise anyconventional sensor for collecting light. The connection surface 485 ofthe imaging device comprises a bonding area configured to bond with asubstrate and configured to provide a means for electrical communicationbetween the inputs and outputs (not shown) of the imaging device 499 andthe components 489 of the substrate. Preferably, the imaging device 499is coupled to the substrate assembly 498 with conductive bumps 495 usingflip-chip packaging techniques. However, the flip-chip connection of thepresent invention differs slightly from traditional flip-chip packaging,in that the conductive bumps used for coupling are located on the sameside as the imaging surface 480 and are coupled to the substrateassembly 498 through the bottom of the substrate assembly 498. Theconductive bumps 495 are used as the means for electrical communicationbetween the inputs and outputs (not shown) of the imaging device 499 andthe components 489 on the substrate surface 401.

The aperture 497 of the substrate assembly 498 are configured such thatthe imaging surface 480 of the imaging device 499 is exposed through theaperture 497 and the connection surface 485 is substantially concealedwhen coupled. As such, the amount of space on the top of the substratesurface 401 available for components 489 is not affected by the size ofthe connection surface 485 of the imaging device 499, and therefore canbe maximized. This allows the size of the substrate assembly 498 to besmaller, and in turn allows the size of the module (not shown) to besmaller.

The housing 490 comprises a cylindrical surface 484, a barrel cavity488, ramps 487, slots 486 and a housing base 485. The housing base 485is configured to be coupled to the top of the substrate 498 and furthercomprises a cavity (not shown) for containing the components 489.

FIG. 4B illustrates a side schematic cross-section view of the of anultra-compact camera module 400 utilizing flip-chip coupling accordingto some embodiments of the present invention. As shown, an actuatorassembly 410 is coupled to a lens barrel 430, and the lens barrel 430 isfurther coupled to a barrel housing 490. In some embodiments of thepresent invention, the lens barrel 430 is movable without causingrotation of the actuator assembly 410 by rotating a ramp bridge 460(explained above). In alternative embodiments of the present invention,the lens barrel 430 is movable by holding the actuator assembly 410 witha fixture and rotating the lens barrel 430 (explained above).

Furthermore, a imaging device 499 is coupled to the bottom of asubstrate 498. The substrate 498 is configured with a substrate cavity496 and an aperture 497 passing therethrough. Preferably, the substratecavity 496 is configured such that imaging device 499 is completelyhoused vertically within the substrate cavity 496. Furthermore, a numberof electrical components 489 are coupled to the substrate 498.

The imaging device 499 is bonded to the substrate assembly 498 viaconductive bumps 495. The conductive bumps 495 are configured to couplethe imaging device 499 to the substrate assembly 498 and also to providea means for electrical communication between the inputs and outputs (notshown) of the imaging surface (not shown) and the components 489. Insome embodiments of the present invention, the imaging device 499 isbonded to the substrate assembly 498 in a thermocompression reaction byapplying heat and pressure. In other embodiments, the imaging device 499is bonded to the substrate assembly 498 by using thermosonic joining. Inyet other embodiments, the imaging device 499 is bonded to the substrateassembly 498 by conductive adhesive bonding. In general, any bondingtechnique can be used to bond the imaging device 499 to the substrateassembly 498.

In some embodiments of the present invention, a number of contactattachment pads 402 are included to electronically couple the imagingdevice 499 and the electronic components 489 with other electronics in acamera mechanism. In some embodiments, the contact attachment pads areintegrally formed as part of the substrate assembly 498. In otherembodiments, the contact attachment pads 402 are coupled to the bottomand sides of the substrate assembly 498. As such, the ultra-compactcamera module 400 is easily able to be electrically coupled with otherelectronic devices such as cellular telephones and PDA devices, amongother devices for ultra-compact camera applications.

The method of bonding the imaging device 499 to the substrate assembly498 using flip-chip techniques achieves an object of the presentinvention: to reduce the size of the camera module. As explained above,other objects of the present invention include the ability to focus thelens package of the module 400 without rotating the actuator assembly410 in relation to the imaging device 499.

The present application has been described in terms of specificembodiments incorporating details to facilitate the understanding of theprinciples of construction and operation of the power amplificationcircuit. Many of the components shown and described in the variousfigures can be interchanged to achieve the results necessary, and thisdescription should be read to encompass such interchange as well. Assuch, references herein to specific embodiments and details thereof arenot intended to limit the scope of the claims appended hereto. It willbe apparent to those skilled in the art that modifications can be madeto the embodiments chosen for illustration without departing from thespirit and scope of the application.

1.-25. (canceled)
 26. An ultra compact camera comprising: a. a basesubstrate having a first surface, a second surface, and an aperture; b.an imaging device, the imaging device having an active surface and apassive surface, wherein imaging device is coupled to the second surfaceof the base substrate such that the active surface faces the aperture.27. The ultra compact camera of claim 26 wherein the imaging device ismounted to base substrate by a flip chip method.
 28. The ultra compactcamera of claim 26 wherein the imaging device comprises an array ofcharge coupled devices.
 29. The ultra compact camera of claim 26 whereinthe imaging device is mounted to the substrate by conductive bumps. 30.The ultra compact camera of claim 26 further comprising an actuatormounted to the first surface of the base substrate.
 31. The ultracompact camera of claim 30 wherein the actuator comprises an opening ona first end and second end defining a barrel cavity for allowing lightto pass therethrough to the active surface of the imaging device. 32.The ultra compact camera of claim 31 further comprising a lens mountedwithin the barrel cavity, wherein the focuses the lens with respect tothe imaging device.
 33. The ultra compact camera of claim 32 wherein thelens is mounted to the actuator by threading.
 34. The ultra compactcamera of claim 33 wherein the treading comprises ramps.
 35. The ultracompact camera of claim 26 further comprising additional electricalcomponents mounted to the substrate, wherein the additional electricalcomponents are in electrical communication with the imaging device. 36.The ultra compact camera of claim 35 wherein the additional electricalcomponents are mounted to the first surface of the substrate.
 37. Theultra compact camera of claim 36 wherein the substrate compriseselectrical connections therethrough for enabling electricalcommunication between the additional components and the imaging device.38. An ultra compact camera housing comprising: a. a base substratehaving a first surface and a second surface and an aperture; b. animaging device, having an image sensing surface, mounted using flip chiptechniques on the second side of the base substrate such that the imagesensing surface is exposed through the aperture; c. an actuator assemblyhaving a lens housed therein coupled to the first surface of the basesubstrate such that light is allowed to pass through the lens and theaperture for affecting the image sensing surface, wherein the actuatormoves the lens for focusing an image onto the image sensing surface. 39.The ultra compact camera housing of claim 38 further comprising at leastone additional electrical component coupled to the first surface of thebase substrate, wherein the at least one additional electrical componentis electrically coupled to the imaging device.
 40. A camera comprising:a. a base substrate having an aperture; and b. an imaging device havingan imaging surface, wherein the imaging surface is coupled to the basesubstrate such that the imaging surface is exposed through the aperture.41. The camera of claim 40 wherein the imaging device is mounted to basesubstrate by a flip chip method.
 42. The camera of claim 40 wherein theimaging surface comprises an array of charge coupled devices.
 43. Thecamera of claim 40 wherein the imaging device is mounted to thesubstrate by conductive bumps.
 44. A camera comprising: a. a basesubstrate having an aperture; b. an imaging device having an imagingsurface, wherein the imaging surface is coupled to the base substratesuch that the imaging surface is exposed through the aperture; and c. Anactuator having at least one optical element coupled to the basesubstrate such that light passing through the at least one opticalelement then impinges on the imaging surface.
 45. The camera of claim 44wherein the imaging device is mounted to base substrate by a flip chipmethod.
 46. The camera of claim 44 wherein the imaging surface comprisesan array of charge coupled devices.
 47. The camera of claim 44 whereinthe imaging device is mounted to the substrate by conductive bumps. 48.A method of manufacturing an ultra compact camera housing comprisingmounting an imaging device, the image sensor having an image sensingsurface, to a second surface of a base substrate using flip chiptechniques, the base substrate having an aperture, such that the imagesensing surface is exposed through the aperture.